IGBT Bonder
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FUNCTION | Specification |
material size range | 0.5mm-16mm |
Wafer chip thickness | Above 40um |
material size range | X、Y ≤ ±10μm,angle θ ≤ 0.05°。 |
Single placement speed | Mounting time < 2.5s (calculate by picking, positioning and mounting time). |
Feeding method | Wafer (8 inch and 12 inch) automatic loading and unloading |
Feeding method | Clip(44mm)、Tray |
Feeding method | can be programmed Solder tab cutting length (2 to 14mm) |
Feeding method | Feeder loading for NTC |
Feeding method | vibrating plate |
Transfer | Standard Size of pink pan |
EQ function | ① Spray alcohol at the bottom for material positioning. |
② It has the function of air pressure dispensing. | |
③ It can be customized and supports up to 10 suction nozzles. | |
④ Visual software: use self-developed visual system to automatically identify materials. | |
⑤ SMT head function: pressure control 1N to 30N | |
Equipment yield | Yield rate≥99.98%. |
Communication support | SECS/GEM |
automation | connection supports only |