IGBT Bonder
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| FUNCTION | Specification |
| material size range | 0.5mm-16mm |
| Wafer chip thickness | Above 40um |
| material size range | X、Y ≤ ±10μm，angle θ ≤ 0.05°。 |
| Single placement speed | Mounting time < 2.5s (calculate by picking, positioning and mounting time). |
| Feeding method | Wafer (8 inch and 12 inch) automatic loading and unloading |
| Feeding method | Clip(44mm)、Tray |
| Feeding method | can be programmed Solder tab cutting length (2 to 14mm) |
| Feeding method | Feeder loading for NTC |
| Feeding method | vibrating plate |
| Transfer | Standard Size of pink pan |
| EQ function | ① Spray alcohol at the bottom for material positioning. |
| ② It has the function of air pressure dispensing. | |
| ③ It can be customized and supports up to 10 suction nozzles. | |
| ④ Visual software: use self-developed visual system to automatically identify materials. | |
| ⑤ SMT head function: pressure control 1N to 30N | |
| Equipment yield | Yield rate≥99.98%. |
| Communication support | SECS/GEM |
| automation | connection supports only |