Semiconductor Automation    Display Automation    ETC

Laser Drilling System

This equipment is for laser Drilling for the substrate.
The equipment features have a nanosecond UV laser or IR Fiber laser source and i3 engineering Drilling optics in the device, which can be processing the semiconductor substrate products.

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It Is Possible For
  • The Max. loading Strip size is 270mm X 98mm
  • The Max. loading Strip thickness is dependent on the Drill size
  • Laser Drill is available for through-hole and half drill
  • The laser Drill material is available for EMC, polyimide, Resin, and ceramic.

This system will utilize the i3 engineering technology and can support the base on customer required