Laser Cutting System

This equipment is for laser cutting for the substrate.
The equipment features have a nanosecond UV laser or Green laser source and i3 engineering Cutting optics in the device, which can be processing the semiconductor substrate products.


It Is Possible For
  • The Max. loading Strip size is 240mm X 95mm
  • The Max. loading Strip thickness is 0.5mm
  • Laser cutting is available for Line-cut, shape-cut, and round-cut.
  • The laser cutting material is available for PCB, metal, Copper, polyimide, Resin, FR4, Teflon, and ceramic.

This system will utilize the i3 engineering technology and can support the base on customer required