Laser Trimming System

This equipment is for laser Trimming to Resin with ABF on the substrate.The equipment features have a Co2 laser source and i3 engineering Trimming optics in the device, which can be processing the PCB substrate products.


It Is Possible For
  • The loading substrate size is 510mm X 515mm
  • The ABF and Resin thickness is about 900um ~ 1,000um
  • The laser Trim is available for Line Trim, Round Trim.

This system will utilize the i3 engineering technology and can support the base on customer required