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Micro Laser Cutting system

This equipment is for Laser small Chip Cutting to the micro chip Substrate
The equipment features a Nanosecond UV laser source and i3 engineering Laser Special optics in this device, which can be processing the substrate products.

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It Is Possible For
  • The Max. Substrate size is 80mm X 84mm
  • The Cutting chip size is 0.2mm X 0.4mm ±15um
  • Laser Cutting is available for Straight lines, Round Shapes, ETC