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ABF Laser Trim system

This equipment for laser Trimming to Resin with ABF on substrate.
The equipment features it has Co2 laser source and i3 engineering Trimming optics in this device, can be processing the semiconductor substrate products.

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It Is Possible For
  • The loading substrate size 510mm X 515mm
  • The ABF and Resin thickness about 900um ~ 1,000um
  • The ABF Thickness check before laser Trimming
  • The Real-time laser power check system