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Dicing / Sorter system

This equipment is for PCB substrate, and semiconductor package Sorting to Tray after the sawing process on the productions. The equipment features a pick and place module, Tray auto replacement, and the inspection vision camera in the device, which can process the semiconductor substrate products.

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It Is Possible For
  • The loading Max. substrate size 300mm X 300mm Before Sawing
  • The Sorting unit size 3mm X 3mm ~ 110mm X 110mm After Sawing
  • The Sorting UPH 14K (3mm X 3mm)
  • The Sorting UPH 0.3K (110mm X 110mm)