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Laser Opening system

This equipment is for Laser square opening to Full panel FR4 PCB substrate.
The equipment features a Picosecond Green laser source and i3 engineering Laser cutting optics in this device can process the PCB substrate products.

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It Is Possible For
  • The loading substrate size is 479x491mm ~ 510x515mm
  • The PCB substrate thickness is about 0.2mm ~ 2.0mm
  • The laser etching available material to Copper, FR4 / prepreg