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Laser Decapsulation & Deflash System

This equipment is for Laser Decapsulation and Deflash to Semiconductor substrate.The equipment features have a nanosecond UV laser source and i3 engineering optics in this device can be processing the PCB substrate or lead-frame products.

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It Is Possible For
  • Loading/Unloading Based on the magazine to magazine
  • The max. loading substrate size is 100mm X 100mm
  • The laser Decapsulation is available to PI film and EMC material.

This system will utilize the i3 engineering technology and can support the base on customer required