Advanced Laser Soldering Placement System

This Equipment is for Laser Soldering to Semiconductor substrates and PCB-based frames.
The equipment features a nanosecond IR fiber laser source and a special Laser soldering Module of i3Engineering in this device can process the substrate and PCB-based products.

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It Is Possible For

We had 2 types of Laser Soldering Placement System

  • The type of BGA Solder Ball Attach
  • The type of Wafer Bumping