Advanced Laser Soldering Placement System
This Equipment is for Laser Soldering to Semiconductor substrates and PCB-based frames.
The equipment features a nanosecond IR fiber laser source and a special Laser soldering Module of i3Engineering in this device can process the substrate and PCB-based products.
It Is Possible For
We had 2 types of Laser Soldering Placement System
- The type of BGA Solder Ball Attach
- The type of Wafer Bumping